Question 3 of 8: Atom count and dopant fraction in a silicon wafer
Nivaar worked solution (AI-drafted; not reviewed by a licensed engineer)
Notes on this paper
Paper format. National Exams — 16-Mec-B8 Engineering Materials, undated sitting (the printed footer reads 16-Mec-B8/May 2019). Three hours; any non-communicating calculator permitted. Eight problems, all of equal value; any FIVE constitute a complete paper, so each problem is worth 20 marks. Candidates are urged to submit a clear statement of any assumptions made. All eight problems are solved below.
Note on this sitting. Five of the eight problems restate standing 22-Mec-B8 archetypes with fresh or unchanged data — the magnesium sacrificial anode, the FRP consolidation essay (problem 5, now asking for three routes and for their applicability to primary versus secondary structure rather than four routes and their trade-offs alone), the ABS-versus-phenolic selection (problem 6), the aluminium–lithium floor-beam substitution (problem 7, restated in kilograms rather than newtons) and Considère necking (problem 8). Problems 1, 2 and 3 are new to the subject: they are Faraday's-law corrosion rate, Fick's first law applied to carburizing, and an atom-counting exercise on a silicon wafer. Every calculation has been re-worked from this paper's own numbers.
Question 3: Atom count and dopant fraction in a silicon wafer (20 marks)
Given. A standard 150 mm (six-inch) semiconductor wafer of pure single-crystal silicon:
Given data
Quantity
Symbol
Value
Wafer diameter
d
150 mm = 15.0 cm
Wafer thickness
t
0.5 mm = 0.05 cm
Density of silicon
ρ
2.33 g/cm3
Atomic mass of silicon
M
28.09 g/mol
Avogadro's number
NA
6.022 × 1023 mol−1
Phosphorus doping level
NP
1016 atoms/cm3
Find. (a) the total number of silicon atoms in the wafer, and (b) the atomic fraction of phosphorus once the wafer is doped.
The wafer, and the scale of the doping. The geometry gives 8.836 cm³ and hence 4.41 × 10²³ silicon atoms; the doping bar shows why the answer to (b) is so small — 10¹⁶ phosphorus atoms per cubic centimetre against 5.0 × 10²² silicon atoms is one part in five million, and the red line marking it has been drawn far wider than scale so that it is visible at all.
Approach. Get the volume from the wafer geometry, turn it into a mass and then into moles using the density and atomic mass, and multiply by Avogadro's number; for part (b), divide the stated phosphorus concentration by the silicon atom concentration the same calculation implies.
Part (a) — compute the volume of the wafer. Treating it as a right circular disc, $$V = \frac{\pi d^{2}}{4}t = \frac{\pi (15.0)^{2}}{4}(0.05) = \frac{\pi(225)(0.05)}{4}$$ $$V = 8.836\ \text{cm}^{3}$$ Real wafers carry a flat or a notch to mark the crystal orientation, which removes well under one per cent of the area; the question gives no such detail, so the full disc is used.
Convert the volume into a mass and then into moles. $$m = \rho V = (2.33)(8.836) = 20.59\ \text{g}$$ $$n = \frac{m}{M} = \frac{20.59}{28.09} = 0.7329\ \text{mol}$$ A six-inch wafer therefore holds about three quarters of a mole of silicon, which weighs a little over twenty grams — a useful figure to carry, because it makes the final answer easy to sanity-check.
Multiply by Avogadro's number. $$N = n N_A = (0.7329)(6.022\times10^{23})$$ $$\boxed{\ N = 4.41\times10^{23}\ \text{silicon atoms}\ }$$
Confirm the answer from the crystal structure instead of the density. Silicon has the diamond-cubic structure, eight atoms per unit cell, with $a = 0.5431$ nm, so $$N_{Si} = \frac{8}{(5.431\times10^{-8})^{3}} = 4.994\times10^{22}\ \text{atoms/cm}^{3}$$ and over the wafer volume that gives $(4.994\times10^{22})(8.836) = 4.412\times10^{23}$ atoms. The two routes agree to 0.03 per cent, which is a genuine check: one used the measured bulk density, the other the measured lattice parameter, and nothing but internal consistency links them.
Part (b) — form the atomic fraction of phosphorus. The silicon atom concentration follows from part (a) as $$N_{Si} = \frac{N}{V} = \frac{4.4135\times10^{23}}{8.836} = 5.00\times10^{22}\ \text{atoms/cm}^{3}$$ Phosphorus is a substitutional dopant, so it replaces silicon on the lattice and the atomic fraction is $$X_P = \frac{N_P}{N_P + N_{Si}} = \frac{10^{16}}{10^{16} + 5.00\times10^{22}}$$ $$\boxed{\ X_P = 2.00\times10^{-7}\ }$$
Restate the fraction in units an engineer will recognise. That is $2.00\times10^{-5}$ atomic per cent, or 0.20 atomic parts per million — one phosphorus atom for every five million silicon atoms. Because the dopant is so dilute, dropping it from the denominator changes nothing: $10^{16}/5.00\times10^{22}$ gives the same $2.00\times10^{-7}$ to three figures. The remarkable point is that a fraction this small transforms the material: intrinsic silicon at room temperature carries only about $1.5\times10^{10}$ carriers per cubic centimetre, so 1016 donors raise the free-electron concentration by roughly six orders of magnitude and the conductivity with it.
Results for the silicon wafer
Quantity
Relation
Value
Wafer volume
V = πd2t/4
8.836 cm3
Wafer mass
m = ρV
20.59 g
Moles of silicon
n = m/M
0.7329 mol
(a) Atoms in the wafer
N = nNA
4.41 × 1023 atoms
Check from the diamond-cubic cell
8/a3 × V
4.412 × 1023 atoms (0.03 % apart)
Silicon atom concentration
NSi = N/V
5.00 × 1022 cm−3
(b) Atomic fraction of phosphorus
XP = NP/(NP+NSi)
2.00 × 10−7 (0.20 atomic ppm)
Check: the density and atomic mass of silicon are not given in the question and are taken as 2.33 g/cm3 and 28.09 g/mol, the standard values; both should be quoted as assumptions in the answer book. The wafer is treated as a full disc, ignoring the orientation flat, which for a 150 mm wafer removes under one per cent of the volume. The doping is assumed uniform through the thickness, as the question's wording implies; a real wafer doped by ion implantation or by diffusion carries a strongly non-uniform profile, and 1016 cm−3 would then be a peak or an average rather than a constant.