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17-Phys-B6 Applied Thermodynamics and Heat Transfer · May 2016

Question 7 of 8: Combined Free Convection and Radiation from a Power Transistor

Nivaar worked solution (AI-drafted; not reviewed by a licensed engineer)

Notes on this paper

Paper format. 98-Phys-B6 Applied Thermodynamics and Heat Transfer, National Examination May 2016 — a three-hour open-book examination; candidates are expected to bring both a thermodynamics text and a heat-transfer text to make use of the property tables and charts. A complete examination is five questions — either three from Part A (Thermodynamics, Q1–Q4) and two from Part B (Heat Transfer, Q5–Q8), or two from Part A and three from Part B — every question carrying equal value; all eight are solved below as a complete study set. Where the exam's own "state your assumptions" licence applies (Part A cold-air-standard properties in Question 3; the rectangular-case geometry read from the printed illustration in Question 7), the assumption is flagged explicitly in a check callout rather than hedged inside the answer.

Reference texts. Y. A. Çengel and M. A. Boles, Thermodynamics: An Engineering Approach, 8th ed. (ideal-gas processes, vapour power cycles, gas-turbine/Brayton cycles, vapour-compression refrigeration); F. P. Incropera and D. P. DeWitt, Fundamentals of Heat and Mass Transfer, 7th ed. (conduction with convective boundaries, internal/external convection correlations, natural convection, radiation exchange, cross-flow heat-exchanger effectiveness–NTU analysis).

Question 7: Combined Free Convection and Radiation from a Power Transistor

Question text not reproduced: the examination questions are © Engineers and Geoscientists BC. Open the official past paper (linked at the top of this page) to read the question, then follow the worked solution below.

Given. Power dissipation 0.18 W; ambient air $25\,{}^{\circ}\text{C}$; surrounding enclosure (radiation sink) $35\,{}^{\circ}\text{C}$; surface emissivity 0.1; case 0.4 cm × 0.4 cm × 0.45 cm, mounted base-in (base excluded from heat transfer).

[Figure not reproduced: Power transistor case dimensions. See the official exam paper or the cited reference text.]

Fig. 6 — power transistor case as printed: 0.4 cm square face, 0.45 cm deep.
Given data
QuantitySymbolValue
Power dissipated$\dot{Q}$0.18 W
Ambient air temperature$T_{\text{air}}$$25\,{}^{\circ}\text{C}$
Enclosure (radiation) temperature$T_{\text{surr}}$$35\,{}^{\circ}\text{C}$
Surface emissivity$\varepsilon$0.1
Case dimensions$H\times W\times D$0.4 × 0.4 × 0.45 cm

Find. The steady surface temperature $T_s$ of the transistor case.

Approach. Sum natural-convection and radiation losses from the five exposed faces (base excluded), set equal to the dissipated power, and solve implicitly for $T_s$ — convection exchanges with the AIR temperature while radiation exchanges with the (different) ENCLOSURE temperature, since they are physically distinct surroundings.

  1. Exposed area (base excluded). One far face ($H\times W$) plus four side faces ($H\times D$ and $W\times D$, two each): $$A_s=(0.004)(0.004)+2(0.004)(0.0045)+2(0.004)(0.0045)=8.80\times10^{-5}\text{ m}^2$$
  2. Natural-convection coefficient (Cengel's simplified free-convection relation for a small vertical surface in air, characteristic length = case height $L_c=H=0.004$ m): $$h=1.42\left(\frac{\Delta T}{L_c}\right)^{1/4}\quad[\text{W/m}^2\text{K, }\Delta T\text{ in K, }L_c\text{ in m}]$$
  3. Energy balance (implicit in $T_s$). $$\dot{Q}=h(T_s)\,A_s\,(T_s-T_{\text{air}}) + \varepsilon\sigma A_s\!\left(T_s^4-T_{\text{surr}}^4\right)$$ Solved numerically (the natural-convection $h$ itself depends on $T_s$ through $\Delta T$): $$\boxed{T_s\approx 132.0\,{}^{\circ}\text{C}},\qquad h\approx18.2\text{ W/m}^2\text{K}$$
  4. Check the energy split. At the solution, convection carries $h A_s(T_s-T_{\text{air}})\approx0.166$ W and radiation carries the remaining $\approx0.014$ W — consistent with the low emissivity (0.1) making radiation a minor contributor for this surface.

A tiny (88 mm2) exposed area, a low emissivity, and no forced airflow together make this a poor passive heat-rejection path, so a $107\,{}^{\circ}\text{C}$ rise above ambient air for only 0.18 W is physically reasonable — the same reason small unheat-sinked transistor packages are commonly derated or fitted with a small clip-on heat sink in practice.

Question 7 — results
QuantityValue
Exposed surface area, $A_s$88.0 mm2
Natural-convection coefficient, $h$18.2 W/m2K
Surface temperature, $T_s$$132.0\,{}^{\circ}\text{C}$