17-Phys-B6 Applied Thermodynamics and Heat Transfer · May 2016
Nivaar worked solution (AI-drafted; not reviewed by a licensed engineer)
Paper format. 98-Phys-B6 Applied Thermodynamics and Heat Transfer, National Examination May 2016 — a three-hour open-book examination; candidates are expected to bring both a thermodynamics text and a heat-transfer text to make use of the property tables and charts. A complete examination is five questions — either three from Part A (Thermodynamics, Q1–Q4) and two from Part B (Heat Transfer, Q5–Q8), or two from Part A and three from Part B — every question carrying equal value; all eight are solved below as a complete study set. Where the exam's own "state your assumptions" licence applies (Part A cold-air-standard properties in Question 3; the rectangular-case geometry read from the printed illustration in Question 7), the assumption is flagged explicitly in a check callout rather than hedged inside the answer.
Reference texts. Y. A. Çengel and M. A. Boles, Thermodynamics: An Engineering Approach, 8th ed. (ideal-gas processes, vapour power cycles, gas-turbine/Brayton cycles, vapour-compression refrigeration); F. P. Incropera and D. P. DeWitt, Fundamentals of Heat and Mass Transfer, 7th ed. (conduction with convective boundaries, internal/external convection correlations, natural convection, radiation exchange, cross-flow heat-exchanger effectiveness–NTU analysis).
Question text not reproduced: the examination questions are © Engineers and Geoscientists BC. Open the official past paper (linked at the top of this page) to read the question, then follow the worked solution below.
Given. Power dissipation 0.18 W; ambient air $25\,{}^{\circ}\text{C}$; surrounding enclosure (radiation sink) $35\,{}^{\circ}\text{C}$; surface emissivity 0.1; case 0.4 cm × 0.4 cm × 0.45 cm, mounted base-in (base excluded from heat transfer).
[Figure not reproduced: Power transistor case dimensions. See the official exam paper or the cited reference text.]
| Quantity | Symbol | Value |
|---|---|---|
| Power dissipated | $\dot{Q}$ | 0.18 W |
| Ambient air temperature | $T_{\text{air}}$ | $25\,{}^{\circ}\text{C}$ |
| Enclosure (radiation) temperature | $T_{\text{surr}}$ | $35\,{}^{\circ}\text{C}$ |
| Surface emissivity | $\varepsilon$ | 0.1 |
| Case dimensions | $H\times W\times D$ | 0.4 × 0.4 × 0.45 cm |
Find. The steady surface temperature $T_s$ of the transistor case.
Approach. Sum natural-convection and radiation losses from the five exposed faces (base excluded), set equal to the dissipated power, and solve implicitly for $T_s$ — convection exchanges with the AIR temperature while radiation exchanges with the (different) ENCLOSURE temperature, since they are physically distinct surroundings.
A tiny (88 mm2) exposed area, a low emissivity, and no forced airflow together make this a poor passive heat-rejection path, so a $107\,{}^{\circ}\text{C}$ rise above ambient air for only 0.18 W is physically reasonable — the same reason small unheat-sinked transistor packages are commonly derated or fitted with a small clip-on heat sink in practice.
| Quantity | Value |
|---|---|
| Exposed surface area, $A_s$ | 88.0 mm2 |
| Natural-convection coefficient, $h$ | 18.2 W/m2K |
| Surface temperature, $T_s$ | $132.0\,{}^{\circ}\text{C}$ |