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22-Elec-B6 Integrated Circuit Engineering · May 2017

Question 4 of 6: Body Effect, Charge Sharing and the C 2 MOS Flip-Flop

Nivaar worked solution (AI-drafted; not reviewed by a licensed engineer)

Notes on this paper

Paper format. National Exams May 2017 — 16-Elec-B6, Integrated Circuit Engineering. Three hours, closed book, scientific calculator permitted. Six questions are printed; any five constitute a complete paper and the total is 100 marks. Formulae and constants are supplied on the last page of the examination. All six questions are solved here, so the paper can be used as a complete study resource.

Reference texts.

In Fig. Q4.2 the gate lead of M4 ends at its own input terminal, labelled C, and is not connected to the internal node between M2 and M3. Q4-2 is solved on that reading.

Question 4: Body Effect, Charge Sharing and the C2MOS Flip-Flop (20 marks)

Question text not reproduced: the examination questions are © Engineers and Geoscientists BC. Open the official past paper (linked at the top of this page) to read the question, then follow the worked solution below.

Given. Fig.Q4.1 is a two-input NAND: pMOS devices M1 (gate $B$) and M2 (gate $A$) in parallel between $V_{DD}$ and $Y$; nMOS devices M3 (gate $A$, drain at $Y$) and M4 (gate $B$, source at ground) in series. All nMOS bulks are tied to ground and all pMOS bulks to $V_{DD}$. Fig.Q4.2 is a footed dynamic gate: precharge pMOS M1 and foot nMOS M5 both gated by CLK; the pull-down network is M2 (gate $A$) in series with M3 (gate $B$), in parallel with M4 (gate $C$). Fig.Q4.3 is two cascaded clocked inverters: stage 1 transparent when $\text{CLK}=1$, stage 2 transparent when $\text{CLK}=0$.

Find. The body-effect device and its consequence, and a design change; the dynamic gate's output in both clock phases and the input pattern that causes charge sharing; the logic at nodes A and B of the C2MOS cell in each clock phase, and a proof that it tolerates clock skew.

Approach. Identify, for each circuit, which node is not tied to a rail — the internal source node in the NAND stack, the internal pull-down node in the dynamic gate, and the two dynamic storage nodes in the flip-flop — because every part of this question turns on the behaviour of those nodes.

Part 1(a) — the device subject to body effect.

  1. Locate the terminal that is not on a rail. M1 and M2 have their sources at $V_{DD}$ and their bulks at $V_{DD}$, so $V_{SB}=0$ for both pMOS devices. M4 has its source at ground and its bulk at ground, so $V_{SB}=0$ as well. Only M3 has its source at the internal node $X$ between the two series nMOS devices, and $X$ is free to sit above ground. Therefore only M3 is subject to body effect.
  2. State the effect quantitatively. The threshold voltage of a device with a reverse-biased source-to-bulk junction is $$V_{TN}=V_{TN0}+\gamma\left(\sqrt{|2\phi_F|+V_{SB}}-\sqrt{|2\phi_F|}\right),$$ where $\gamma$ is the body-effect coefficient. With $V_{SB}=V_X>0$ the threshold of M3 rises, its gate overdrive $V_{GS}-V_{TN}$ falls, its drain current falls and its equivalent on-resistance rises. The consequences are a longer $t_{pHL}$ at $Y$, a slightly higher switching threshold for the gate as seen from input $A$, and reduced noise margin at the low output level.
VDDAM1BM2YAM3internal node XBM4V of M3 sits here, not at 0 Vso V(SB) of M3 can be positive
Figure 4.1 — the NAND of Fig.Q4.1 with the internal node $X$ marked. Only M3 has a source that can float above ground, so only M3 sees a non-zero $V_{SB}$.

Part 1(b) — the design change.

  1. Apply the input-ordering rule first, because it is free. Body effect only bites if the internal node $X$ is charged when M3 turns on. If the earlier signal drives the device nearer ground, that device discharges $X$ before the later signal arrives, so M3 switches with $V_{SB}\approx 0$. Since input $B$ leads input $A$, the required assignment is $B$ on M4 (nearest ground) and $A$ on M3 (nearest the output) — which is exactly how Fig.Q4.1 is already wired. Confirm this before changing anything: had the connections been the other way round, $X$ would charge to $V_{DD}-V_{TN}$ while $A$ alone was high, and M3 would then switch with a strongly elevated threshold.
  2. Then make the change that actually removes the mechanism. With the ordering already correct, the remaining modification available to the designer is to stop tying M3's bulk to ground: place M3 in its own isolated p-well (a triple-well or deep-n-well process) and connect that well to M3's source, so $V_{SB}=0$ under every input sequence, including the case where $A$ happens to arrive first: $$\boxed{\text{tie the bulk of M3 to its own source rather than to ground.}}$$
  3. Note the cheaper fallback. If the process offers only a common p-substrate, widen M3 relative to M4 to compensate for its raised threshold, or add a small nMOS from $X$ to ground gated by $\overline{Y}$ to keep $X$ discharged while the gate is idle. Both cost area; neither is as clean as the separate well.

Part 2(a) — the dynamic gate's output.

  1. Precharge phase, $\text{CLK}=0$. M1 conducts and M5 is off, so the pull-down network is disconnected from ground and the output node is charged to $V_{DD}$ regardless of $A$, $B$ and $C$: $$Y=V_{DD}\quad\text{(logic 1), independent of the inputs.}$$ No current path from $V_{DD}$ to ground exists, which is why the foot device is present.
  2. Evaluation phase, $\text{CLK}=1$. M1 is off and M5 conducts, so the output falls whenever the pull-down network conducts. That network is M2 in series with M3 (conducting when $A\cdot B$) in parallel with M4 (conducting when $C$), so $$\boxed{Y=\overline{A\cdot B+C}\;=\;\overline{A\cdot B}\cdot\overline{C},}$$ an AND-OR-INVERT (AOI21) gate. For any input pattern that does not satisfy $A\cdot B+C$, the output holds its precharged value dynamically on the capacitance of node $Y$.

Part 2(b) — the charge-sharing inputs.

  1. Identify the internal node. Node $X$ between M2 and M3 carries its own parasitic capacitance $C_X$ (the junction capacitances of M2 and M3 plus their overlap capacitances). It is not precharged, so at the end of a cycle in which it was discharged it sits at 0 V.
  2. Find the pattern that connects $X$ to $Y$ without discharging $Y$. M2 conducts when $A=1$, joining $X$ to $Y$. For the output to merely droop rather than discharge fully, no complete path to ground may exist, which requires $B=0$ and $C=0$. Checking all eight patterns confirms this is the only one: $$\boxed{A=1,\quad B=0,\quad C=0.}$$ If $B=1$ as well, or $C=1$, the node discharges to ground — that is the intended logic function, not charge sharing. If $A=0$, M2 is off and $X$ is never connected to $Y$.
  3. Quantify the droop. Charge is conserved across the two capacitors when M2 turns on, so $$C_YV_{DD}=(C_Y+C_X)V_Y\quad\Longrightarrow\quad V_Y=V_{DD}\frac{C_Y}{C_Y+C_X},\qquad \Delta V=V_{DD}\frac{C_X}{C_Y+C_X}.$$ With representative values $C_Y=20$ fF and $C_X=5$ fF at $V_{DD}=1.2$ V, the output settles at $V_Y=1.2\times20/25=0.960$ V, a droop of $0.240$ V. That is comfortably enough to eat the noise margin of a following gate, and is why real designs precharge the internal nodes as well, or add a keeper.
before evaluationafter charge redistributionYCY20 fFCX5 fF1.200 V0.000 Vswitch openYCY20 fFCX5 fF0.960 V0.960 Vswitch closedM2 turns oncharge is conserved on the two capacitors
Figure 4.2 — charge redistribution when $A=1$, $B=0$, $C=0$. The precharged output shares its charge with the undriven internal node, dropping from 1.200 V to 0.960 V for the values shown.

Part 3(a) — the C2MOS node expressions.

  1. Read the enabling conditions off the clock devices. In stage 1 the pull-up path contains a pMOS gated by $\overline{\text{CLK}}$ and the pull-down path an nMOS gated by CLK, so both paths are enabled together only when $\text{CLK}=1$; when $\text{CLK}=0$ both are cut and node A is in a high impedance state. Stage 2 has the clock phases interchanged, so it is enabled when $\text{CLK}=0$ and high impedance when $\text{CLK}=1$.
  2. State the two phases. When $\text{CLK}=1$, stage 1 acts as an ordinary inverter and stage 2 holds: $$A=\overline{D},\qquad B=B_{\text{previous}}\ \text{(held dynamically on the node capacitance).}$$ When $\text{CLK}=0$, stage 1 holds and stage 2 acts as an inverter: $$A=A_{\text{held}}=\overline{D}\big|_{\text{at the falling edge}},\qquad \boxed{B=\overline{A}=D\big|_{\text{at the falling edge}}.}$$ The value that appears at $B$ is therefore the value $D$ had when CLK last fell: this is a negative edge-triggered D flip-flop, with the master formed by stage 1 and the slave by stage 2.
CLKDnode Anode B12345678t
Figure 4.3 — timing of the C2MOS cell. Node A tracks $\overline{D}$ while CLK is high and freezes when CLK falls; node B updates only on the falling edge.

Part 3(b) — skew insensitivity. Clock skew means CLK and $\overline{\text{CLK}}$ are not exact complements: for a short interval they can both be high (a 1-1 overlap) or both be low (a 0-0 overlap). Race-through means new data at $D$ reaching node B within the same clock event, and it must be shown to be impossible in both overlap cases.

  1. Case 1-1 overlap: both clock phases high. Every pMOS gated by a clock phase is off, so stage 1 reduces to a pull-down-only network and so does stage 2. Stage 1 can therefore only drive node A low. But stage 2's pull-down path requires its input device, gated by node A, to conduct — that is, it requires $A=1$. Since A can only fall, it can never rise to enable that path during the overlap. A new value of $D$ can propagate at most one stage, and node B is untouched.
  2. Case 0-0 overlap: both clock phases low. Now every nMOS gated by a clock phase is off, so both stages reduce to pull-up-only networks. Stage 1 can only drive node A high; stage 2's pull-up path needs its input device gated by node A to conduct, which requires $A=0$. Again the required condition is the opposite of the only motion available, so no path from $D$ to node B exists.
  3. Conclude. In both overlap cases the two stages are reduced to networks of the same polarity, and a two-stage inverting chain of one polarity cannot propagate a signal — each stage passes a transition in the one direction the next stage cannot accept: $$\boxed{\text{no race-through path exists for either clock overlap, so the cell is skew tolerant.}}$$ The tolerance holds provided the overlap is shorter than the sum of the propagation delays of the two stages; beyond that, and in the presence of slow clock edges, the pseudo-static version with feedback keepers is required.
Sub-partResult
1(a) device with body effect M3 only ($V_{SB}=V_X>0$); raised $V_{TN}$, lower drive, longer $t_{pHL}$, reduced noise margin
1(b) design change Ordering already correct because $B$ leads $A$; tie the bulk of M3 to its own source in an isolated p-well
2(a) precharge phase$Y=V_{DD}$ for all inputs
2(a) evaluation phase$Y=\overline{A\cdot B+C}$ (AOI21)
2(b) charge-sharing inputs $A=1$, $B=0$, $C=0$; $V_Y=V_{DD}C_Y/(C_Y+C_X)=0.960$ V for $C_Y=20$ fF, $C_X=5$ fF, $V_{DD}=1.2$ V
3(a) $\text{CLK}=1$$A=\overline{D}$; B holds
3(a) $\text{CLK}=0$A holds; $B=D$ sampled at the falling edge — negative edge-triggered
3(b) skewBoth overlaps reduce the pair to same-polarity networks; no race-through path